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Call for Papers

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Important Dates

Submission Deadline:2011/12/12
Submission extended:2011/12/16
Author Notification:2012/02/14
Final Version Due:2011/02/28
Workshop commences:2012/05/03 - 2012/05/04

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Contact

Local Organisation
cosade2012{at}cased.de

Special Sessions

DPA Contest v3 (Results) and v4 (Announcement)

Foto Telecom Paristech
Telecom Paristech (ENST)

Dr. Guillaume Duc
Département Communications et Electronique
Télécom ParisTech (ENST), France

The DPA Contest v3 is organized jointly by the National Institute of Advanced Industrial Science and Technology (AIST) and the VLSI research group from Télécom ParisTech french University.

The two first editions of the contest were attack contests (the first against DES and the second against AES), i.e. participants were asked to develop their own attacks that used traces acquired by the organizers to find the key.

However, for Side Channel Analysis, the acquisition phase of the attack is also very important. So this third edition is an acquisition contest, where participants are provided with an AES design to be loaded on the SASEBO GII board, and have to acquire their own traces.

Using Multi-Area Diode Lasers and Developing EM FI Tools

Foto Riscure
                      Riscure

Eloi Sanfelix Gonzalez
Security Analyst at Riscure

Most secure chips incorporate fault injection detection mechanisms to protect critical processes. In these cases, injection of a second fault on the fault detection mechanism may lead to a successful security breach. The required timing for the second fault is usually different, but also the required target die location may differ.

Overcoming these problems requires multi-time and multi-area laser systems respectively. During the first part of the presentation we present design considerations and specifications for such a multi-time and multi-area laser system, and show the system in operation.

In order to meet multi-timing requirements such as accurate timing, high speed switching and multiple light pulses, we selected a diode laser system. For the multi-area requirements, we considered two alternative designs: one with multiple beams through one objective and one with an additional beam through a glass fiber.

The two designs differ regarding laser spot size, maximum distance between spots and extendibility to multiple laser beams. Detailed specifications of a laser system with microscope and glass fibers will be given.

A smart card security evaluation with two laser pulses at two different locations will be demonstrated to provide insight in the analysis steps, the required amount of information for the analysis and its complexity.

On the second part of the presentation, we describe the development of an EM Fault Injection probe. We will provide an overview of design options, design criteria and explain our choice.